ROM :
Standard 16GB EMMC, up to 128GB Display
eDP :
Standard eDP interface, supporting up to 1080 resolution
TF Card :
Self-elastic TF card socket, supports 256GB TF card
POE :
1-way POE power receiving interface
Operating Temperature :
-20℃~70℃
Model Number :
H-3399 Mainboard
Place of Origin :
China
MOQ :
Negotiable
Price :
Negotiable
Payment Terms :
T/T
Supply Ability :
200+/day
CPU :
RK3399, dual-core Cortex-A72+ quad-core Cortex-A53, Clock up to 1.8GHz
Serial ports :
2-way TTL/RS232compatible built-in serial port
Pilot lamp :
Green work indicator light
Structure Compatibility :
Compatible with H0、H3 structure and interchangeable
HDMI :
HDMI 2.0 interface, supporting up to 4K resolution
MIC Input :
Differential MIC input
USB OTG :
1 USB3.0 OTG interface
Size :
100mm* 80mm
LVDS :
Supporting up to 1080P resolution
Amplifier Output :
8 ohm·-6W dual- channel audio amplifier output
MIPI :
31Pin FPC MIP-DSI interface, supporting up to 1920x1200 resolution
Line Output :
Standard left and right channel line output
Linux System :
Linux Buildroot, Debian 9, Ubuntu18.04 Optional
DC Input :
12V DC socket, supports 9V-15V wide voltage input
USB Host :
2 external USB3.0, 8 built-in USB2.0 (one of which is CPU pass-through USB)
Ethernet :
1-way 10/100/1000Mbps adaptive Ethernet
Humidity :
0%-95% (non-condensing)
12C :
2-way I2C interface
Bluetooth :
High-performance Bluetooth, Support BT V4.0
GPU :
Mali-G52 2EE
Wi-Fi :
High-performance WiFi, supports 802.11 b/g/n/ac
RAM :
Standard 2GB LPDDR4, optional 4GB
Backlight :
1-way backlight control interface, supports switch and brightness adjustment
Delivery Time :
5-8 work days
RTC :
Low power consumption RTC circuit with CR1220 battery
Headphone :
American standard four-stage headset integrated 3.5mm socket
Android system :
Recommended Android 7.1, Android 8.1 and Android 9.0 are optional
Infrared :
Infrared receiving pin header
Button :
Burn button and power button
GPIO :
5-way GPIO signals
Thickness :
9mm
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